Design Issues

Sun-Fly does not take responsibility for design issues once the customer has confirmed their designs for production from either their design or prototype. Most designs translate perfectly well to the chip material and Sun-Fly does give advice if there could be design issues. We suggest that the customer has prototypes made if they want to ensure the design comes out as they have envisaged. Some design problems that can occur are centralisation, bleeding, colour variations, too much detail on the design itself and lettering/wording being too small.

If any problems are due to a manufacturing problem such as damaged or broken chips then we will discuss the course of action that should be taken with the client and would look into compensating the customer. Below are some of the possible design issues that should be taken into consideration when designing chips.

Damages during Shipping

Sun-Fly cannot be held responsible should packages or a shipment arrive with a customer damaged. All goods are packaged and checked before leaving our factory by the shipping company. The shipping company in question would be held responsible for any breakages during shipping.

If a damaged package arrives then the customer should notify the shipping company at once. If you are to open a package then be sure to photograph the package before, during and after opening.